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www.rohm.com tsz02201-0rar1g200650-1-2 ?2013 rohm co., ltd. all rights reserved. 1/18 12.apr.2013 rev.001 tsz22111 ? 15 ? 001 datashee t operational amplifiers series input/output full swing low power operational amplifiers LM7101G general description the LM7101G operational amplif ier provides on both the input and output full swing operation. the LM7101G is high voltage gain, low distortion, low consumption current. it?s suitable for battery operation mobile equipment. features ? high voltage gain ? low distortion ? low operating supply voltage ? low input bias current ? low supply current ? input/output full swing applications ? customer electronics ? buffer ? active filter ? mobile equipment ? battery equipment simplified schematic key specifications ? low operating supply voltage (single supply): +1.8v to +5.0v ? wide temperature range: 40c to +85c ? low input bias current: 1pa (typ.) ? input offset voltage: 3.5mv (max.) ? high voltage gain(rl=10 k ? ): 100db(typ.) package w(typ.) xd(typ.) xh(max.) ssop5 2.90mm x 2.80mm x 1.25mm figure1. simplified schematic product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays.
datasheet www.rohm.com tsz02201-0rar1g200650-1-2 ?2013 rohm co., ltd. all rights reserved. 2/18 12.apr.2013 rev.001 tsz22111 ? 15 ? 001 LM7101G 34 2 15 + - -in out +in vee vcc pin configuration LM7101G : ssop5 pin no. pin name 1 out 2 vee 3 +in 4 -in 5 vcc package ssop5 LM7101G ordering information l m 7 1 0 1 g - t r part number lm7101 package g:ssop5 packaging and forming specification tr: embossed tape and reel line-up topr package operable part number -40c to +85c ssop5 reel of 3000 LM7101G-tr absolute maximum ratings (ta=25c) parameter symbol ratings unit supply voltage vcc-vee +7 v power dissipation pd ssop5 675 *1*2 mw differential input voltage *3 vid vcc to vee v input common-mode voltage range vicm (vee - 0.3) to (vcc + 0.3) v input current *4 ii -10 ma operable with low volta ge vopr +1.8 to +5.0 v operating temperature topr - 40 to +85 c storage temperature tstg - 55 to +150 c maximum junction temperature tjmax +150 c note: absolute maximum rating item indicates the condition which must not be exceeded. application of voltage in excess of absolute maximum rating or use out absolute maximum rated temperature environment may cause deterioration of characteristics. *1 to use at temperature above ta 25c reduce 5.4mw/c. *2 mounted on a fr4 glass epoxy pcb(70mm70mm1.6mm). *3 the voltage difference between inverting input and non-inverting input is the differential input voltage. then input terminal voltage is set to more than vee. *4 when input terminal voltage is about vee-0.6v, the input te rminal current will be a very large value. adding a limit resi stor, the input current will be smaller than the maximum limit.
datasheet www.rohm.com tsz02201-0rar1g200650-1-2 ?2013 rohm co., ltd. all rights reserved. 3/18 12.apr.2013 rev.001 tsz22111 ? 15 ? 001 LM7101G electrical characteristics : LM7101G (unless otherwise s pecified vcc=+1.8v, vee=0v) parameter symbol temperature range limits unit condition min. typ. max. input offset voltage *5*6 vio 25c - 0.1 3 mv vin= vcc/2 full range - - 3.5 input offset voltage drift vio/ t 25c - 2 - v/c - input bias current *5 ib 25c - 1 200 pa - supply current *6 icc 25c - 760 1100 a av=0db, vin= vcc/2 full range - - 1200 maximum output voltage(high) voh 25c 100 30 - mv rl=2k ? to vcc/2 50 10 - rl=10k ? to vcc/2 maximum output voltage(low) vol 25c - 30 100 mv rl=2k ? to vcc/2 - 10 50 rl=10k ? to vcc/2 large signal voltage gain av 25c 84 100 - db rl=10k ? to vcc/2 84 95 - rl=2k ? to vcc/2 input common-mode voltage range vicm 25c vee - vcc-0.1 v vee to vcc-0.1v common-mode rejection ratio cmrr 25c 60 90 - db vcm=0.5v power supply reject-ratio psrr 25c 65 100 - db vcc=1.8v to 5.0v vcm=0.5v output source current *7 isource 25c - 6 - ma out=0v, short current output sink current *7 isink 25c - 6 - ma out=1.8v, short current slew rate sr 25c - 1.2 - v/ s rl=2k ? to vcc/2 out=1.4v p-p gain bandwidth gbw 25c - 1.5 - mhz cl=25pf, rl=10k ? av=40db, f=100khz phase margin 25c - 45 - deg cl=25pf, rl=10k ? av=40db gain margin gm 25c - 9 - db cl=25pf, rl=10k ? av=40db input referred noise voltage vn 25c - 35 - hz nv/ f=1khz total harmonic distortion+ noise thd+n 25c - 0.004 - % out=1.4v p-p , f=1khz rl=2k ? to vcc/2 av=0db, din-audio *5 absolute value. *6 full range: ta=-40c to +85c *7 under the high temperature environment, consider the power dissipation of ic when selecting the output current. when the terminal short circuits are continuously output, the ou tput current is reduced to clim b to the temperature inside ic.
datasheet www.rohm.com tsz02201-0rar1g200650-1-2 ?2013 rohm co., ltd. all rights reserved. 4/18 12.apr.2013 rev.001 tsz22111 ? 15 ? 001 LM7101G LM7101G (unless otherwise s pecified vcc=+5.0v, vee=0v) parameter symbol temperature range limits unit condition min. typ. max. input offset voltage *8*9 vio 25c - 0.1 3 mv vin= vcc/2 full range - - 3.5 input offset voltage drift vio/ t 25c - 2 - v/c - input bias current *8 ib 25c - 1 200 pa - supply current *9 icc 25c - 800 1300 a av=0db, vin=vcc/2 full range - - 1400 maximum output voltage(high) voh 25c 150 50 - mv rl=2k ? to vcc/2 400 150 - rl=600 ? to vcc/2 maximum output voltage(low) vol 25c - 50 150 mv rl=2k ? to vcc/2 - 100 400 rl=600 ? to vcc/2 large signal voltage gain av 25c 84 100 - db rl=10k ? to vcc/2 84 95 - rl=2k ? to vcc/2 input common-mode voltage range vicm 25c vee - vcc v vee to vcc common-mode rejection ratio cmrr 25c 60 90 - db vcm=0.5v power supply reject-ratio psrr 25c 65 100 - db vcc=1.8v to 5.0v vcm=0.5v output source current *10 isource 25c 80 - ma out=0v, short current output sink current *10 isink 25c 80 - ma out=5v, short current slew rate sr 25c - 1.2 - v/ s rl=2k ? to vcc/2 out=4v p-p gain bandwidth gbw 25c - 1.5 - mhz cl=25pf, rl=10k ? av=40db, f=100khz phase margin 25c - 45 - deg cl=25pf, rl=10k ? av=40db gain margin gm 25c - 9 - db cl=25pf, rl=10k ? av=40db input referred noise voltage vn 25c - 35 - hz nv/ f=1khz total harmonic distortion+ noise thd+n 25c - 0.004 - % out=4v p-p , f=1khz rl=2k ? to vcc/2 av=0db, din-audio *8 absolute value *9 full range: ta=-40c to +85c *10 under the high temperature environment, consider the power dissipation of ic when selecting the output current. when the terminal short circuits are continuously output, the ou tput current is reduced to clim b to the temperature inside ic.
datasheet www.rohm.com tsz02201-0rar1g200650-1-2 ?2013 rohm co., ltd. all rights reserved. 5/18 12.apr.2013 rev.001 tsz22111 ? 15 ? 001 LM7101G description of electri cal characteristics described here are the terms of electric characteristics used in this datasheet. items and symbols used are also shown. note that item name and symbol and t heir meaning may differ from those on anot her manufacture?s document or general document. 1. absolute maximum ratings absolute maximum rating item indicates the condition which must not be exceeded. application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. 1.1 power supply voltage (vcc/vee) indicates the maximum voltage that can be applied between the positive power supply terminal and negative power supply terminal without deterioration or destruct ion of characteristics of internal circuit. 1.2 differential input voltage (vid) indicates the maximum voltage that can be applied between non-inverting terminal and inverting terminal without deterioration and destruction of characteristics of ic. 1.3 input common-mode voltage range (vicm) indicates the maximum voltage that can be applied to non- inverting terminal and inverting terminal without deterioration or destruction of characteristics. input common-mode voltage range of the maximum ratings not assures normal operation of ic. when normal operation of ic is desired, the input common-mode voltage of characteristics item must be followed. 1.4 power dissipation (pd) indicates the power that can be consumed by spec ified mounted board at t he ambient temperature 25 (normal temperature). as for package product, pd is determined by the temper ature that can be permitted by ic chip in the package (maximum junction temperature) and t hermal resistance of the package. 2. electrical characteristics item 2.1 input offset voltage (vio) indicates the voltage difference between non-inverting termi nal and inverting terminal. it can be translated into the input voltage difference required for setting the output voltage at 0 v. 2.2 input offset voltage drift ( vio/ t) denotes the ratio of the input offset voltage fluc tuation to the ambient te mperature fluctuation. 2.3 input bias current (ib) indicates the current that flows into or out of the input terminal. it is defined by the average of input bias current at non-inverting terminal and input bias current at inverting terminal. 2.4 circuit current (icc) indicates the ic current that flows under specified conditions and no-load steady status. 2.5 maximum output voltage(high) / maximum output voltage(low) (voh/vol) indicates the voltage range of the outpu t under specified load condition. it is typically divided into maximum output voltage high and low. maximum output voltage high indica tes the upper limit of out put voltage. maximum output voltage low indicates the lower limit. 2.6 output source current/ output sink current (isource/isink) the maximum current that can be output under specific output conditions, it is divided into output source current and output sink current. the output source current indicates the current flowing out of the ic, and the output sink current the current flowing into the ic. 2.7 large signal voltage gain (av) indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting terminal. it is normally the amplifying rate (gain) with reference to dc voltage. av = (output voltage) / (differential input voltage) 2.8 input common-mode voltage range (vicm) indicates the input voltage range where ic operates normally. 2.9 common-mode rejection ratio (cmrr) indicates the ratio of fluctuation of input offset voltage when in-phase input voltage is changed. it is normally the fluctuation of dc. cmrr = (change of input common-mode voltage)/(input offset fluctuation) 2.10 power supply rejection ratio (psrr) indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. it is normally the fluctuation of dc. psrr= (change of power supply volt age)/(input offset fluctuation) 2.11 slew rate (sr) indicates the time fluctuation ratio of volt age output when step input signal is applied. 2.12 gain band width (gbw) indicates to multiply by the frequency and the gai n where the voltage gain decreases 6db/octave. 2.13 phase margin ( ) indicates the margin of phase from 180 de gree phase lag at unity gain frequency. 2.14 gain margin (gm) indicates the difference between 0db and the gain wher e operational amplifier has 180 degree phase delay. 2.15 total harmonic distortion + noise (thd+n) indicates the fluctuation of input offset voltage or that of output vo ltage with reference to the change of output voltage of driven channel. 2.16 input referred noise voltage (vn) indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in series with input terminal.
datasheet www.rohm.com tsz02201-0rar1g200650-1-2 ?2013 rohm co., ltd. all rights reserved. 6/18 12.apr.2013 rev.001 tsz22111 ? 15 ? 001 LM7101G typical performance curves LM7101G 1.0 2.0 3.0 4.0 5.0 6.0 123456 supply voltage [v] output voltage high [v] 650 700 750 800 850 900 1.0 2.0 3.0 4.0 5.0 6.0 supply voltage [v] supply current [ a] -40 25 85 figure 3. supply current ? supply voltage 650 700 750 800 850 900 -50-25 0 255075100 ambient temperature [c] supply current [ a] 1.8v 5.0v figure 4. supply current ? ambient temperature figure 5. output voltage high ? supply voltage (rl=2k ? ) -40 25 85 0 200 400 600 800 0 255075100 ambient temperature [c] power dissipation [mw] figure 2. derating curve 85 LM7101G (*)the data above is measurement value of typical sample, it is not guaranteed.
datasheet www.rohm.com tsz02201-0rar1g200650-1-2 ?2013 rohm co., ltd. all rights reserved. 7/18 12.apr.2013 rev.001 tsz22111 ? 15 ? 001 LM7101G typical performance curves (reference data) ? continued LM7101G 1.0 2.0 3.0 4.0 5.0 6.0 -50-25 0 255075100 ambient temperature [c] output voltage high [v] 10 15 20 25 30 -50 -25 0 25 50 75 100 ambient temperature [c] output voltage low [mv] 0 2 4 6 8 10 00.511.52 output voltage [v] output source current [ma] 10 15 20 25 30 123456 supply voltage [v] output voltage low [mv] -40 25 85 -40 25 85 figure 9. output source current ? output voltage (vcc=1.8v) figure 6. output voltage high ? ambient temperature (rl=2k ? ) 5.0v 1.8v figure 7. output voltage low ? supply voltage (rl=2k ? ) figure 8. output voltage low ?ambient temperature (rl=2k ? ) 5.0v 1.8v (*)the data above is measurement value of typical sample, it is not guaranteed.
datasheet www.rohm.com tsz02201-0rar1g200650-1-2 ?2013 rohm co., ltd. all rights reserved. 8/18 12.apr.2013 rev.001 tsz22111 ? 15 ? 001 LM7101G typical performance curves (reference data) ? continued LM7101G -4 -3 -2 -1 0 1 2 3 4 123456 supply voltage [v] input offset voltage [mv] 0 3 6 9 12 15 0.0 0.5 1.0 1.5 2.0 output voltage [v] output sink current [ma] 0 20 40 60 80 100 -50-250 255075100 ambient temperature [c] output source current [ma] figure 10. output source current ?ambient temperature -40 25 85 figure 11. output sink current ? output voltage (vcc=1.8v) 0 20 40 60 80 100 -50-25 0 25 50 75100 ambient temperature [c] output sink current [ma] figure 12. output sink current ? ambient temperature figure 13. input offset voltage ? supply voltage (*)the data above is measurement value of typical sample, it is not guaranteed. 25 85 -40 5.0v 1.8v 5.0v 1.8v
datasheet www.rohm.com tsz02201-0rar1g200650-1-2 ?2013 rohm co., ltd. all rights reserved. 9/18 12.apr.2013 rev.001 tsz22111 ? 15 ? 001 LM7101G typical performance curves (reference data) - continued LM7101G -4 -3 -2 -1 0 1 2 3 4 -50 -25 0 25 50 75 100 ambient temperature [c] input offset voltage [mv] 80 90 100 110 120 -50-250 255075100 ambient temperature [c] large signal voltage gain [db] . 80 90 100 110 120 123456 supply voltage [v] large signal voltage gain [db] . -4 -3 -2 -1 0 1 2 3 4 -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 in pu t vol tage [v] input offset voltage [mv] 85 25 -40 figure 15. input offset voltage ? input voltage (vcc=5v) figure 14. input offset voltage ? ambient temperature figure 17. large signal voltage gain ? ambient temperature -40 25 85 figure 16. large signal voltage gain ? supply voltage 5.0v 1.8v 1.8v 5.0v (*)the data above is measurement value of typical sample, it is not guaranteed.
datasheet www.rohm.com tsz02201-0rar1g200650-1-2 ?2013 rohm co., ltd. all rights reserved. 10/18 12.apr.2013 rev.001 tsz22111 ? 15 ? 001 LM7101G typical performance curves (reference data) ? continued LM7101G 80 90 100 110 120 -50 -25 0 25 50 75 100 ambient temperature [c] common mode rejection ratio [db ] 80 90 100 110 120 123456 supply voltage [v] common mode rejection ratio [db] 0.5 0.8 1.1 1.4 1.7 2.0 -50 -25 0 25 50 75 100 ambient temperature [c] slew rate l-h [v/ s] -40 25 85 figure 18. common mode rejection ratio ? supply voltage (vcc=1.8v) 80 90 100 110 120 -50-25 0 25 50 75100 ambient temperature [c] power supply rejection ratio [db] figure 20. power supply rejection ratio ? ambient temperature ( vcc=1.8v ~ 5.0v ) figure 19. common mode rejection ratio ? ambient temperature figure 21. slew rate l-h ? ambient temperature (*)the data above is measurement value of typical sample, it is not guaranteed. 5.0v 1.8v 5v 1.8v
datasheet www.rohm.com tsz02201-0rar1g200650-1-2 ?2013 rohm co., ltd. all rights reserved. 11/18 12.apr.2013 rev.001 tsz22111 ? 15 ? 001 LM7101G typical performance curves (reference data) - continued LM7101G 0.5 0.8 1.1 1.4 1.7 2.0 -50 -25 0 25 50 75 100 ambient temperature [c] slew rate h-l [v/ s] figure 22. slew rate h-l ? ambient temperature 0 20 40 60 80 100 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 1.e+05 frequency [khz] gain[db] 0 50 100 150 200 phase [deg] phase gain figure 23. voltage gain, phase ? frequency 1.8v 5v (*)the data above is measurement value of typical sample, it is not guaranteed. 1 10 10 2 10 3 10 4 10 5
datasheet www.rohm.com tsz02201-0rar1g200650-1-2 ?2013 rohm co., ltd. all rights reserved. 12/18 12.apr.2013 rev.001 tsz22111 ? 15 ? 001 LM7101G application information test circuit1 null method vcc, vee, ek, vicm unit:v parameter vf s1 s2 s3 vcc vee ek vicm calculation input offset voltage vf1 on on off 3 0 -1.5 3 1 large signal voltage gain vf2 on on on 3 0 -0.5 1.5 2 vf3 -2.5 common-mode rejection ratio (input common-mode voltage range) vf4 on on off 3 0 -1.5 0 3 vf5 3 power supply rejection ratio vf6 on on off 2.5 0 -1.2 0 4 vf7 5.0 calculation 1. input offset voltage (vio) 2. large signal voltage gain(av) 3. common-mode rejection ratio (cmrr) 4. power supply rejection ratio (psrr) vio |vf1| = 1+rf/rs [v] a v |vf2-vf3| = 2 (1+rf/rs) [db] 20log cmrr |vf4 - vf5| = 3 (1+rf/rs) [db] 20log psrr |vf6 - vf7| = 3.2 (1+ rf/rs) [db] 20log figure 24.test circuit1 vcc rf=50k ri=10k 0.1f rs=50 rl sw3 500k 500k 0.01f e k 15v dut vee vrl 50k vicm sw1 0.1f ri=10k vo vf rs=50 1000pf 0.1f -15v null
datasheet www.rohm.com tsz02201-0rar1g200650-1-2 ?2013 rohm co., ltd. all rights reserved. 13/18 12.apr.2013 rev.001 tsz22111 ? 15 ? 001 LM7101G switch condition for test circuit 2 sw no. sw1 sw2 sw3 sw4 sw5 sw 6 sw7 sw8 sw9 sw10 sw11 sw12 supply current off off on off on off off off off off off off maximum output voltage rl=10k ? off on off off on off off on off off on off output current off on off off on off off off off on off off slew rate off off on off off off on off on off off on unit gain frequency on off off on on off off off on off off on figure 26. slew rate input output wave vh vl input wave t input voltage v/ t output voltage 90% 10% figure 25. test circuit2 sw sw1 sw2 sw9 sw10 sw11 sw8 sw6 sw7 cl sw12 sw4 r1 1k r2 100k rl vee vcc=3v vo vin- vin+
datasheet www.rohm.com tsz02201-0rar1g200650-1-2 ?2013 rohm co., ltd. all rights reserved. 14/18 12.apr.2013 rev.001 tsz22111 ? 15 ? 001 LM7101G examples of circuit voltage follower inverting amplifier non-inverting amplifier figure 28. inverting amplifier circuit figure 29. non-inverting amplifier circuit for inverting amplifier, in is amplified by voltage gain decided r1 and r2, and phase reversed voltage is outputted. out is shown next formula. out=-(r2/r1) ? in input impedance is r1. for non-inverting amplifier, in is amplified by voltage gain decided r1 and r2, and phase is same with in. out is shown next formula. out=(1+r2/r1) ? in this circuit realizes high input impedance because input impedance is operational am plifier?s input impedance. figure 27. voltage follower vss vout vin vdd vss r2 vdd vin vout r1 voltage gain is 0db. this circuit controls output voltage (out) equal input voltage (in), and keeps out with stable because of high input impedance and low output impedance. out is shown next formula. out=in out in out in out in vcc vee vcc vee vcc vee
datasheet www.rohm.com tsz02201-0rar1g200650-1-2 ?2013 rohm co., ltd. all rights reserved. 15/18 12.apr.2013 rev.001 tsz22111 ? 15 ? 001 LM7101G 0 200 400 600 800 0 255075100125 ambient temperature [ ] power dissipation [mw] . power dissipation power dissipation (total loss) indicates the power that can be c onsumed by ic at ta=25(normal temperature).ic is heated when it consumed power, and the temperature of ic ship bec omes higher than ambient temper ature. the temperature that can be accepted by ic chip depends on circuit configurati on, manufacturing process, and consumable power is limited. power dissipation is determined by the temperature allowed in ic chip (maximum junction temperature) and thermal resistance of package (heat dissipation capability). the maximum junction temperature is typically equal to the maximum value in the storage package (heat dissipation capability). t he maximum junction temperature is typically equal to the maximum value in the storage temperature range. heat generated by consumed power of ic radiates from the mold resin or lead frame of the package. the parameter which indicates th is heat dissipation capability ( hardness of heat release) is called thermal resistance, represented by the symbol ja /w. the temperature of ic insi de the package can be estimated by this thermal resistance. figure30(a) shows the model of thermal resi stance of the package. thermal resistance ja, ambient temperature ta, junction temperature tj, and power dissipation pd can be calculated by the equation below: ja = (tjmax ta ) / p d /w ????? ( ) derating curve in figure30. (b) indicates power that can be consumed by ic with reference to ambient temperature. power that can be consumed by ic begins to attenuate at certain ambient temperature. this gradient is determined by thermal resistance ja. thermal resistance ja depends on chip size, power consumptio n, package, ambient te mperature, package condition, wind velocity, etc even when the same of package is used. thermal reduction curve indicates a reference value measured at a specified condition. figure31 sh ow a derating curve for an example of lm7101 . when using the unit above ta=25 , subtract the value above per degree . permissible dissipation is the value when fr4 glass epoxy board 70mm 70mm 1.6mm (cooper foil area below 3%) is mounted 5.4 mw/ figure 31. derating curve LM7101G figure 30. thermal resistance and derating 0 50 75 100 125 150 25 p1 p2 pd (max) lsi M [w] ' ja2 ' ja1 tj ' (m ax ) ja2 < ja1 ?? ta [ ] ja2 ja1 tj (m ax ) ambient temperature power dissipation of lsi (b) derating curve a mbient temperature ta [ ] chip surface temperature tj[ ja=(tjmax-ta)/pd /w
datasheet www.rohm.com tsz02201-0rar1g200650-1-2 ?2013 rohm co., ltd. all rights reserved. 16/18 12.apr.2013 rev.001 tsz22111 ? 15 ? 001 LM7101G operational notes 1) unused circuits when there are unused op-amps, it is recommended that they are connected as in figure 32, setting the non-inverting input terminal to a potential within the in-phase input voltage range (vicm). 2) input voltage applying vee-0.3v to the input terminal is possible without causing deterioration of the electrical charac teristics or destruction, regardless of the supply voltage. however, this does not ensure normal circuit operation. please note that the circui t operates normally only when the input voltage is within the common mode input voltage range of the electric characteristics. 3) power supply (single / dual) the op-amp operates when the voltage supplied is between vcc and vee. therefore, the single supply op-amp c an be used as dual supply op-amp as well. 4) power dissipation pd using the unit in excess of the rated power dissipation may c ause deterioration in electrical characteristics including reduced current capability due to the rise of chip temperat ure. therefore, please take into consideration the power dissipation (pd) under actual operating conditions and apply a suff icient margin in thermal des ign. refer to the thermal derating curves for more information. 5) short-circuit between pins and erroneous mounting be careful when mounting the ic on printed circuit boards. the ic may be damaged if it is mounted in a wrong orientation or if pins are shorted together. short circuit may be caused by conductive particles caught between the pins. 6) operation in a str ong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 7) radiation this ic is not designed to withstand radiation. 8) ic handling applying mechanical stress to the ic by deflecting or bending the board may cause fluct uations in the electrical characteristics due to piezo resistance effects. 9) board inspection connecting a capacitor to a pin with low impedance may stre ss the ic. therefore, discharging the capacitor after every process is recommended. in addition, when attaching and detac hing the jig during the inspection phase, make sure that the power is turned off before inspection and removal. furthermore, please take measures against esd in the assembly process as well as during transportation and storage. 10) output capacitor if a large capacitor is connected between the output pin and vee pin, current from the charged capacitor will flow into the output pin and may destroy the ic when the vcc pin is short ed to ground or pulled down to 0v. use a capacitor smaller than 0.1uf between output pin and vee pin. 11) oscillation by output capacitor please pay attention to the oscillati on by output capacitor and in designing an application of negative feedback loop circuit with these ics. vcc vee vicm - + connect to vicm application circuit for unused op-amp figure 32. example of
datasheet www.rohm.com tsz02201-0rar1g200650-1-2 ?2013 rohm co., ltd. all rights reserved. 17/18 12.apr.2013 rev.001 tsz22111 ? 15 ? 001 LM7101G physical dimensions tape and reel information package name ssop5
datasheet www.rohm.com tsz02201-0rar1g200650-1-2 ?2013 rohm co., ltd. all rights reserved. 18/18 12.apr.2013 rev.001 tsz22111 ? 15 ? 001 LM7101G e mie ? 2 b2 e marking diagram land pattern data all dimensions in mm pkg land pitch e land space mie land length R? 2 land width b2 ssop5 0.95 2.4 1.0 0.6 revision history date revision changes 12.apr.2013 001 new release product name package type marking lm7101 g ssop5 l0 ssop5(top view) lot number part number marking ssop5
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be us ed on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circui ts, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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